Contactless CPU Cards

Contactless CPU Cards

Contactless CPU Card overview – secure ISO/IEC 14443 smart card for payment, transit, access control and identity applications

Contactless CPU Card | ISO 14443 Secure Smart Card

ISO/IEC 14443 13.56MHz Secure Smart Card for Payment, eID, Transit and Access Control

CedaGlo contactless CPU cards integrate a secure microcontroller, COS support and 13.56MHz contactless communication for projects that require stronger protection than basic memory cards. They are designed for secure identification, closed-loop payment, public transportation, campus cards, healthcare cards and multi-application access systems.

CedaGlo contactless CPU card with ISO IEC 14443 secure smart card design
  • 📡Contactless 13.56MHz
    Fast tap ISO 14443
  • 🔐Secure CPU Platform
    COS & mutual auth
  • ⚙️Project Customization
    Chip, print & encode
  • 🌐Global Application Fit
    ID, transit & access

Product Overview — Contactless CPU Smart Card

A contactless CPU card is a high-security smart card with an embedded microcontroller and contactless RF interface. Compared with basic memory cards, it can support card operating systems, secure file structures, cryptographic functions, mutual authentication and project-level personalization. CedaGlo supplies custom contactless CPU cards based on ISO/IEC 14443 Type A or Type B platforms, with chip selection, card body production, printing, encoding and project support available according to your reader system and application requirements.

Contactless CPU Card — Industry Application Needs

🔒 Security Upgrade

Use CPU-based secure chips with COS, encrypted files, keys and authentication logic for higher protection beyond UID-only or memory cards.

📡 Reader Compatibility

Select ISO/IEC 14443 Type A / Type B, T=CL and chip family according to the reader protocol and software stack.

📋 Multi-Application Use

Support access, ID, transit, membership, campus and wallet applications in one card architecture.

🖨️ Personalization

CMYK printing, UID/serial number, QR/barcode, laser engraving and data personalization all available.

📜 Certification Path

Chip-level and platform-level certifications vary by chip. Payment or ID scheme approvals are confirmed per project and issuing requirement.

Key Advantages of Our Contactless CPU Card

Secure Contactless Performance

13.56MHz communication supports fast tap transactions while the CPU platform enables stronger access control and data protection.

🧩

CPU + COS Flexibility

Choose Java Card, native COS or project-specific operating system options depending on issuer requirements and system integration.

📋

Chip Platform Choice

Support for NXP, Infineon, ST, Fudan, Huada, Unigroup and equivalent secure MCU platforms according to availability and certification needs.

🏭

Custom Card Manufacturing

PVC, PET, PETG or ABS card bodies can be customized with printing, serial number, barcode, QR code, signature panel, magnetic stripe or laser engraving.

🤝

Project-Level Support

CedaGlo helps match chip, memory, protocol, personalization and delivery requirements before mass production.

Key Technical Highlights — Secure CPU Platform

  • 📶
    ISO/IEC 14443 Type A / Type B
    Common 13.56MHz contactless interface for secure smart-card readers and terminals.
  • 🔁
    T=CL Communication
    Supports contactless CPU card communication according to ISO/IEC 14443-4 when supported by the selected chip and COS.
  • 🛡️
    Secure Microcontroller
    Designed for on-card processing, encrypted data storage and mutual authentication.
  • 🔑
    Cryptographic Support
    DES / 3DES / AES / RSA / ECC / SHA / SM algorithms available depending on chip platform and region.
  • 💾
    Memory Options
    From small fixed-function secure ICs to larger Java Card / secure MCU platforms; memory depends on selected chip.
  • ✏️
    Personalization Ready
    UID printing, serial number, QR code, barcode, encoding and issuer data preparation available by project.

Contactless CPU Card — Technical Specifications

ParameterSpecification
Card TypeContactless CPU Smart Card
Operating Frequency13.56 MHz
Standard / ProtocolISO/IEC 14443 Type A or Type B; ISO/IEC 14443-3 / 14443-4 depending on chip
CommunicationContactless RF interface; T=CL for supported CPU platforms
Chip OptionsNXP SmartMX / JCOP, Infineon SECORA / SLE78, ST31 / ST25, Fudan FM1208 / FM1280, Huada CIU9872B, Unigroup THD89 or equivalent
Operating System OptionsJava Card, GlobalPlatform, native COS, proprietary COS, PKI or payment / ID applet options depending on project
User Memory / EEPROMTypical options from 8 KB to 80 KB+; high-security platforms may offer larger NVM / Flash, chip-dependent
Security FeaturesSecure microcontroller, encryption engine, secure key storage, mutual authentication and anti-tamper features depending on chip
Cryptographic AlgorithmsDES, 3DES, AES, RSA, ECC, SHA and SM algorithms depending on chip family and project region
Security CertificationCommon Criteria EAL4+ / EAL5+ / EAL6+ options depending on chip; project-level certification confirmed separately
Data RetentionTypically 10 to 25 years depending on chip
Operating TemperatureTypically -25°C to +70°C; chip and card material dependent
Card SizeCR80, 85.60 × 53.98 mm
Thickness0.76 mm standard; custom thickness available by project
Card MaterialsPVC / PET / PETG / ABS optional
Surface / PrintingCMYK printing, spot color, UID / serial number, QR code, barcode, laser engraving, embossing, signature panel, magnetic stripe optional
Recommended ApplicationsSecure payment, public transport, access control, eID, campus card, loyalty, membership and healthcare card projects

Volume Pricing — Contactless CPU Smart Card

QuantityUnit Price (USD / pc)
100 – 199 pcsFrom US$0.40
200 – 299 pcsFrom US$0.38
300+ pcsContact our sales team for project pricing

* Final price depends on chip platform, COS/app personalization, card material, printing, encoding and quantity. Please confirm with the CedaGlo sales team before production.

Chip Platform Selection Guide — Contactless CPU Card Options

Quick reference: recommended chip / platform direction by use case. Full chip-level data with certifications and China cross-references follows below.

Use CaseRecommended Chip / Platform DirectionBuyer-Facing Notes
Transit / Campus / Closed-Loop PaymentFudan FM1208, FM1280; NXP MIFARE DESFire / MIFARE Plus optionsGood for secure ticketing, campus card and small-value applications; select according to existing reader system.
eID / Citizen Card / HealthcareNXP SmartMX / JCOP, Infineon SECORA ID / SLE78, ST31, Huada CIU9872B, Unigroup THD89Suitable for projects requiring higher secure MCU capability, applets, PKI and long-term identity lifecycle management.
Corporate Access / Employee IDFM1208 / FM1280, SmartMX / JCOP, ST31 or equivalentSupports secure access, employee ID and combined physical / logical identity applications.
Banking / Payment ProjectSmartMX / JCOP, SECORA / SLE78, ST31, Huada CIU9872B, THD89Payment approvals and applet requirements must be confirmed per issuer and project scope.
China Domestic ProjectsFM1208 / FM1280, Huada CIU9872B, Unigroup THD89Chinese secure chips support domestic algorithms and can be matched to local PBOC / transport / social-security project needs.

CedaGlo’s contact, contactless and dual-interface CPU cards share the same secure-MCU chip ecosystem. Supported CPU card chip platforms include NXP SmartMX2, NXP SmartMX3, P60C080, P60C144, P60D024, P60D080, P60D144, P60D145, P71D320, P71D321, Infineon SLE78CFX2400P, SLE78CFX4000P, SLE78CFX5000PH, SLE78CLFX2400P, SLE78CLFX4000P, SLE78CLFX5000PH, SLE78CLFX6280PH, ST31G256, ST31G320, ST31G384, ST31G480, ST33J2M0, Fudan FM1204, FM1208, FM1216, FM1232, FM12CD32, FM1280, Huada CIU9872B, CIU5132A, SHC1302, CIU98M25, CIU98M50, Unigroup Tongxin THD88, THD89, THD88-E80, THD88-E120, THD88-E160, Datang DMT-CFN2HG6, DMT-CBS-CE3D and other contact, contactless and dual-interface CPU card IC solutions.

CPU card migration is project-level — it depends on chip, COS, applet, memory, algorithm, personalization and certification, not a pin-for-pin swap like a basic memory IC. Many secure-MCU platforms ship in contact / contactless / dual configurations from one die, so the same family can appear under more than one interface category below. China-brand chips add SM1–SM4 algorithms alongside international DES/3DES/RSA/ECC/AES.

Buyer Notes

  • Part numbers shown are platform / family ordering codes — the suffix encodes package, ROM/Flash split and options; confirm the exact code and current availability before design-in.
  • Memory figures vary by how each brand quotes it (EEPROM only vs. EEPROM+ROM vs. total Flash/NVM); “up to” values are platform maxima, not guaranteed per-part capacity.
  • Fixed-function contactless ICs (MIFARE DESFire, Fudan FM1204/FM1208) suit transit and access; larger parts are open Java / native-COS platforms for banking, ID and multi-application projects.
  • China equivalents are functional matches, not pin-for-pin — Huada CIU9872B holds EMVCo (cert. ICCN0219), Unigroup THD89 holds SOGIS CC EAL6+; product-level payment/ID certification (EMVCo, Visa, Mastercard, UnionPay, PBOC) is still obtained per project.

Wide reference tables below — scroll horizontally on desktop, or view as stacked cards on mobile.

Contactless CPU Cards

BrandPart Number (orderable)On-chip MemoryCertificationCross-Reference (Intl. ↔ China)Application
NXPMIFARE DESFire EV3 — MF3D2301 / MF3D4301 / MF3D8301 (H = high-cap variant: MF3DH…)2 / 4 / 8 KB NVMCC EAL5+↔ Fudan FM1208 / FM1280 (RF use-case)Transit, access, ticketing, micro-payment, smart city
NXPMIFARE DESFire EV2 — MF3Dx2 (2K / 4K / 8K) — legacy, replaced by EV32 / 4 / 8 KB NVMCC EAL5+↔ Fudan FM1208 (use-case)Transit, ticketing (existing systems)
NXPMIFARE Plus EV2 — MF1P2200 / MF1P4200 (H-variant MF1PH…)2 / 4 KBCC EAL5+↔ Fudan FM11RF08 family (upgrade path)Transit, access, closed-loop ticketing
NXPSmartMX3 P71D321 (contactless configuration)up to ~150 KB FlashCC EAL6+, EMVCo↔ Unigroup THD89 · Huada CIU9872BePassport, eID, contactless bank card
InfineonSLE78CLFX2400P / CLFX4000P / CLFX5000PH (contactless config)240 / 404 / 528 KB NVMCC EAL6+, EMVCo↔ Unigroup THD89eID, ePassport, contactless payment
STMicroelectronicsST31G256 / G320 / G384 / G480 (contactless config, MIFARE/Calypso)256 / 320 / 384 / 480 KB FlashCC EAL6+, EMVCo↔ Fudan FM1280 · Huada CIU9872BTransit (Calypso), eID, payment
Fudan / FMSHFM1204 / FM1204M01 (4K CPU, +1K MIFARE option)4 KB EEPROM (5 KB array)PBOC 2.0↔ NXP MIFARE Plus (use-case)Transit, campus, small-value
Fudan / FMSHFM1208 — FM1208-09 (8K) / FM1208M01 (7K+1K M1) / FM1208-23 (4K+4K S70)8 KB EEPROM, 32 KB ROMPBOC 2.0 (e-wallet)↔ NXP DESFire / MIFARE PlusTransit, campus, highway, micro-payment
Fudan / FMSHFM1280 (contactless configuration, Java / native COS, VHBR)up to 64 KB EEPROMBank-grade secure chip · payment cert. at product level↔ NXP SmartMX / Infineon / STSocial-security, health, transit, citizen card
Huada / HEDCIU9872B / CIU9872B_01 (contactless configuration, 32-bit)80 KB user memoryCC EAL6+, EMVCo (ICCN0219)↔ NXP SmartMX / InfineonDigital-RMB hard wallet, transit, eID
Unigroup TongxinTHD89 (contactless configuration)large-capacity (per ordering code)CC EAL6+ (SOGIS), EMVCo, SM L2↔ NXP SmartMX / InfineonePassport, eID, contactless payment

Contact CPU Cards

BrandPart Number (orderable)On-chip MemoryCertificationCross-Reference (Intl. ↔ China)Application
NXPSmartMX2 — P60C080 / P60C144 (contact)80 / 144 KB EEPROM · 384 KB ROMCC EAL6+, EMVCo↔ Unigroup THD88 · Huada CIU98Banking, eID, TPM
NXPSmartMX3 — P71D320 / P71D321 (contact configuration)up to ~150 KB FlashCC EAL6+, EMVCo↔ Unigroup THD89 · Huada CIU98Banking, SIM/UICC, eID
InfineonSLE78CFX2400P / CFX4000P / CFX5000PH240 / 404 / 500 KB NVMCC EAL6+↔ Fudan FM1280 · Huada CIU98Banking, ePassport, eID, TPM
InfineonSLE78CAX512SPHM (serial / contact)500 KB NVMCC EAL6+↔ Unigroup THD89Secure element, identity, authentication
STMicroelectronicsST33 series (e.g. ST33J2M0 contact config) · ST23 legacyup to 2 MB FlashCC EAL6+, EMVCo↔ Fudan FM1280 · Huada CIU98Banking, eSIM, TPM (FIPS-140-3)
SamsungS3FS / S3 secure-MCU series (contact config)varies by partCC EAL5+/6+, EMVCo↔ Unigroup THD89Banking, SIM, identity
Fudan / FMSHFM1216 (16 KB) · FM1232 (32 KB) · FM1280 (≤64 KB) — contact config16 / 32 / up to 64 KB EEPROM · 64 KB ROMBank-grade · SM cert. · EAL4+ (FM1216/1232)↔ Infineon / NXP / STSocial-security, banking, ESAM/PSAM, citizen card
Huada / HEDCIU5132A (contact SS) · SHC1302 (banking, 32-bit SC100) · CIU98M25 / CIU98M50 (SIM)SHC1302: 256 KB ROM / 10 KB RAM · CIU98M50: 2.5 MB · CIU98M25: 1.25 MB FlashCC EAL · payment cert. at product level↔ Infineon / NXPSocial-security, banking, super-SIM
Unigroup TongxinTHD88-E48 / E80 / E120 / E160 · THC20 / THC80 (SIM)≈48 / 80 / 120 / 160 KB EEPROMCC EAL5+/6+ · payment cert. at product level↔ Infineon / NXPBanking, SIM/USIM, social-security, eID
DatangDMT-CFN2HG6per ordering codeBank-grade · payment cert. at product level↔ Infineon / NXP / STBanking, social-security, eHealth

Dual-Interface CPU Cards

BrandPart Number (orderable)On-chip MemoryCertificationCross-Reference (Intl. ↔ China)Application
NXPSmartMX2 — P60D024 / P60D080 / P60D144 / P60D14524 / 80 / 144 KB EEPROM · 384 KB ROMCC EAL6+, EMVCo↔ Unigroup THD89 · Huada CIU9872BBanking, ePassport, eID, transit
NXPSmartMX3 — P71D320 / P71D321up to ~150 KB Flash · RSA 4096 / ECC 640CC EAL6+, EMVCo↔ Unigroup THD89 · Huada CIU9872BBanking, ePassport, eID
InfineonSLE78CLFX2400P / CLFX4000P (400VP) / CLFX5000PH / CLFX6280PH240 / 404 / 528 / 628 KB NVMCC EAL6+, EMVCo↔ Unigroup THD89 · Huada CIU9872BBanking, eID, ePassport, transit
STMicroelectronicsST31G256 / G320 / G384 / G480 · ST31P320 / P450256 / 320 / 384 / 480 KB · 320 / 450 KB FlashCC EAL6+, EMVCo↔ Fudan FM1280 · Huada CIU9872BBanking, transit, eID, biometric card
SamsungS3 dual-interface secure-MCU seriesvaries by partCC EAL5+/6+, EMVCo↔ Unigroup THD89Banking, identity, fingerprint card
Fudan / FMSHFM1232 (32 KB) · FM12CD32 · FM1280 (≤64 KB) — Java / native COS32 / up to 64 KB EEPROMBank-grade · EAL4+ (FM1232) · payment cert. at product level↔ Infineon / NXP / STBanking, social-security, transit, health, citizen card
Huada / HEDCIU9872B / CIU9872B_01 (32-bit CPU)80 KB user memoryCC EAL6+, EMVCo (ICCN0219)↔ NXP SmartMX / Infineon / STBanking, digital-RMB wallet, ePassport
Unigroup TongxinTHD89 (THD89 1.0.1 series, EMV one-chip dual-app)large-capacity (per ordering code)CC EAL6+ (SOGIS), EMVCo, SM L2, AEC-Q100↔ NXP SmartMX / Infineon / STBanking (domestic+intl), eID, eUICC, social-security
DatangDMT-CBS-CE3Dup to 128 KB EEPROMBank-grade · payment cert. at product level↔ Infineon / NXP / STBanking, eHealth, social-security
NationzZ32 secure-MCU seriesper ordering codeCC EAL · SM L2 · payment cert. at product level↔ NXP / InfineonBanking, identity, IoT secure element

Cross-Reference — International ↔ China CPU Card Chips

InterfaceIntl. Part (Brand)Intl. OriginChina Equivalent (Brand · Part)Match TypeSecurity Level
ContactlessMIFARE DESFire EV3 MF3D8301 (NXP)EUFudan FM1208-09 / FM1280 (RF)Functional equiv.CC EAL5+
ContactlessSmartMX3 P71D321 (NXP)EUUnigroup THD89 / Huada CIU9872BFunctional equiv.CC EAL6+
ContactSmartMX2 P60C080 / P60C144 (NXP)EUUnigroup THD88-E80 / Fudan FM1280Functional equiv.CC EAL6+
ContactSLE78CFX4000P (Infineon)EUFudan FM1280 / Huada SHC1302Functional equiv.CC EAL6+
ContactST33J2M0 (ST)EUFudan FM1280 / Unigroup THD88Functional equiv.CC EAL6+
DualSmartMX2 P60D080 / SmartMX3 P71D320 (NXP)EUUnigroup THD89 / Huada CIU9872BFunctional equiv.CC EAL6+
DualSLE78CLFX5000PH (Infineon)EUUnigroup THD89 / Huada CIU9872BFunctional equiv.CC EAL6+
DualST31G480 / ST31P320 (ST)EUFudan FM1232 / Huada CIU9872BFunctional equiv.CC EAL5+/6+
  • Functional equivalent = same use-case & security level; card OS, applets and payment/ID certification are handled by the issuer per project (standard for any CPU-card change).
  • Security Level = Common Criteria EAL at chip/platform level. THD89 (Unigroup) holds SOGIS CC EAL6+; CIU9872B (Huada) holds EMVCo cert. ICCN0219; most EU platforms are CC EAL6+ with EMVCo.
  • CPU cards are not pin-for-pin drop-ins — migration is at the OS/personalization layer, not the hardware layer.

Standards & Compatibility — ISO 14443 CPU Card

Fully compliant with ISO/IEC 14443-1/2/3/4 and ISO/IEC 7816. Our contactless CPU cards are widely used in EMV contactless payment, transport ticketing, physical access control, university ID, employee badging and other secure identification solutions.

📶 ISO/IEC 14443 Type A / B 🔁 T=CL ISO 14443-4 🖥️ Java Card 🌍 GlobalPlatform 💳 EMV Contactless project-dependent

Application Scenarios — Contactless CPU Smart Card Use Cases

Contactless CPU card used for secure payment and closed-loop e-money project

💳 Payment & Closed-Loop E-Money

Contactless CPU cards can be configured for closed-loop wallets, prepaid value, campus payment and scheme-dependent payment projects.

  • Secure transaction logic
  • Applet / project dependent
  • Reader compatibility check
ISO 14443 CPU card for public transport ticketing and fare collection

🚆 Public Transportation

Use ISO 14443 CPU cards for transit ticketing, stored-value systems, fare collection and city card projects.

  • Fast tap & anti-cloning
  • Durable personalized body
  • Stored-value support
Contactless CPU smart card for government eID and citizen card systems

🏛️ Government eID & Citizen Card

Secure CPU platforms support identity verification, certificate storage, PKI and long lifecycle card management.

  • High security
  • Java Card / native COS
  • Chip certification selection
Secure contactless CPU card for enterprise access control and employee identification

🚪 Corporate Access & Employee ID

Combine employee identification, physical access, secure login and membership functions in a single contactless card.

  • Access control & staff ID
  • Serial number & photo printing
  • Secure login integration
Contactless CPU card for healthcare and social security programs

🏥 Healthcare & Social Security

Project-specific CPU cards can support secure personal data, insurance identity, medical service cards and public service applications.

  • Privacy protection
  • Secure storage
  • Data personalization
Loyalty and membership contactless CPU card for points and member services

🏅 Campus, Loyalty & Membership

Use one smart card for library, attendance, canteen, dormitory, loyalty and member services.

  • Multi-application support
  • Easy branding & personalization
  • Flexible encoding options

Customization & Personalization

Customization ItemAvailable Options
Card BodyPVC, PET, PETG, ABS; CR80 standard; custom thickness or finish on request
PrintingCMYK full-color printing, spot color, matte / glossy finish, anti-scratch overlay options
Security / Visual FeaturesLaser engraving, embossing, signature panel, hologram, UV printing or anti-counterfeit printing by project
Data MarkingUID, serial number, barcode, QR code, employee ID, membership number and project-specific data
Encoding / PersonalizationChip encoding, key initialization, applet loading, file structure and data preparation according to project requirements
PackagingBulk packaging, sorted serial batches, customized label or project packaging available

FAQ — Contactless CPU Card Procurement & Compatibility

What is the difference between a contactless CPU card and a normal RFID card?

A normal RFID memory card mainly stores simple data, while a contactless CPU card includes a secure microcontroller and can support COS, encryption, mutual authentication and application logic. It is a better option for projects requiring higher security and controlled data access.

Can CedaGlo contactless CPU cards work with my existing readers?

Compatibility depends on the reader protocol, chip type, COS and application software. Please confirm whether your system uses ISO/IEC 14443 Type A, Type B, T=CL, MIFARE-compatible functions or a specific Java Card / native COS platform.

Which chip should I choose for an eID, payment or transit project?

For eID and payment projects, secure MCU platforms such as SmartMX / JCOP, SECORA / SLE78, ST31, Huada CIU9872B or Unigroup THD89 may be considered. For transit or closed-loop systems, Fudan FM1208 / FM1280 or MIFARE DESFire / Plus options may also be suitable depending on your reader infrastructure.

Do these cards include EMV, PBOC or government ID certification?

Chip-level certifications and platform capabilities vary by chip. Finished card-level payment, government or issuer certification is project-dependent and should be confirmed with the required scheme, applet, COS and issuing authority.

Can you print and encode cards before shipment?

Yes. CedaGlo can provide custom printing, UID or serial number printing, barcode / QR code, laser engraving, and project-based encoding or personalization. The exact data format and security keys should be confirmed before production.

What information do you need for quotation?

Please share quantity, target application, required chip or memory, reader protocol, printing artwork, encoding requirements, card material, packaging and delivery schedule. If you are not sure about the chip, we can help narrow down the options.

Related Products — Secure Smart Card Solutions

🌐 Global Compliance ISO 14443 A/B · EMV · GlobalPlatform
🛡️ High Security Secure MCU · Encryption · EAL5+/6+
⚙️ Custom Solutions Chip · Print · Encode · Branding
Reliable Quality Strict QC · Project Support

Build Your Secure Contactless CPU Card Project with CedaGlo

Share your application, reader protocol, chip preference and printing requirements. Our team will help confirm the suitable CPU card platform, personalization method and project quotation.

About Us

CedaGlo Group has been providing advanced RFID products for diverse industries for over a decade.  Our comprehensive range includes smart city solutions, retail inventory tracking, warehousing, logistics, and industrial process management.

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