Teslin Card | Synthetic Substrate for Secure ID & RFID
Single-layer microporous material for ID, e-passport & RFID cards
CedaGlo Teslin cards use a single-layer, microporous synthetic substrate engineered for secure credentials and embedded electronics. Trusted by governments and card issuers for its print definition, strong lamination bond, durability and tamper-evident behavior, Teslin is ideal for national ID, driver licenses, e-passport e-covers and RFID cards — with LF, HF / NFC, UHF or contact IC chip options.
- Secure ID
Substrate - High Print
Definition - Tamper-Evident
& Durable - RFID / NFC /
Contact IC
What Is a Teslin Card?
A Teslin card is built on Teslin — a single-layer, microporous synthetic substrate engineered for secure credentials and embedded electronics. Its structure delivers excellent print definition, a strong lamination bond and tamper-evident behavior, which is why it is specified in secure ID and e-passport programs worldwide.
CedaGlo supplies Teslin cards with RFID, NFC or contact IC options, so the same durable substrate can serve national ID, driver licenses, e-passport e-covers and RFID credentials. The microporous structure also cushions and protects embedded chips and antennas, making Teslin a proven choice for high-security, long-life card programs.
Why Issuers Choose Teslin
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A durable, single-layer substrate for secure ID and RFID programs.
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Excellent print definition for identity graphics and variable data.
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Reliable lamination bond and protection for embedded electronics.
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A proven material specified in global credential and e-passport programs.
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Tamper-evident structure that helps reveal alteration or damage.
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Compatible with many digital and security printing and lamination processes.
Our Teslin Card Advantages
High Print Definition
Crisp photo IDs, security graphics and variable data.
Durable & Secure
Tear-, moisture- and chemical-resistant, tamper-evident material.
Chip & Antenna Protection
Microporous structure cushions embedded RFID inlays and chips.
OEM / ODM Support
Artwork, encoding, chip selection and finishing for secure card programs.
Key Material Highlights
Material, Printing & Chip Options
- Single-layer microporous Teslin substrate
- Durable, tear- and chemical-resistant
- Tamper-evident, security-grade material
- Strong lamination bond for long life
- RFID, NFC, contact IC or dual-interface
- HF 13.56 MHz, UHF or secure CPU chips
- Cushions and protects embedded inlays
- CR80 or custom size and structure
- Photo ID printing and variable data
- Barcode, QR code and serial number
- Signature panel and magnetic stripe option
- Encoding, numbering and chip selection
Technical Specifications
| Card Type | Teslin Synthetic Smart Card |
| Material | Teslin synthetic substrate |
| Common Card Size | CR80, 85.60 × 53.98 mm; custom size available |
| Available Structure | Single-layer microporous synthetic substrate |
| Technology Options | RFID, NFC, contact IC, barcode, QR code, serial number |
| Typical Features | Photo ID printing, variable data, signature panel, magnetic stripe (option) |
| Recommended Uses | Secure IDs, RFID cards, membership cards, access credentials |
| Processing Benefit | Fast drying, high ink holdout, good dimensional stability |
| Custom Options | Artwork, numbering, encoding, chip selection, size and finish customization |
Volume Pricing
| Quantity | Unit Price (USD / pc) |
|---|---|
| 100 – 199 pcs | From US$0.45 |
| 200 – 299 pcs | From US$0.42 |
| 300+ pcs | Contact Sales |
Final unit price depends on the selected chip, card structure, printing and order quantity. Contact us for an exact quote based on your project.
Available Chip & Frequency Options
Teslin card bodies can be built with virtually any of the chip platforms below — HF / NFC, UHF, dual-frequency or secure contact / contactless / dual-interface CPU. Use the filter to find a chip by name, brand or application; both tables are searched at once.
Scrolls horizontally on desktop; shows as stacked cards on mobile.
Contactless, NFC & UHF Chips (HF / UHF / Dual-Frequency)
| Chip | Brand | Freq · Standard | Memory | R-W | Security | Best For |
|---|---|---|---|---|---|---|
| HF / NFC · 13.56 MHz — Smart Card, Ticketing & NFC | ||||||
| MIFARE Classic 1K / 4K | NXP | ISO 14443A | 1 / 4 KB EEPROM | Read/Write | Crypto-1 (legacy, broken) | Transit, access, closed-loop ticketing |
| MIFARE Ultralight / C / EV1 / AES | NXP | ISO 14443A · NFC Type 2 | 48–192 B | Read/Write | 3DES / AES-128 | Limited-use tickets, events, transit |
| MIFARE Plus EV1 / EV2 | NXP | ISO 14443A | 2 / 4 KB | Read/Write | AES-128, SL1–SL3 | Transit, access, ticketing |
| MIFARE DESFire EV1 / EV2 / EV3 / Light | NXP | ISO 14443A · NFC Type 4 | 2 / 4 / 8 KB | Read/Write | AES-128, EAL5+, EMVCo | Transit, access, micro-payment, multi-app ID |
| MIFARE DUOX | NXP | ISO 14443-4 | Secure file system | Read/Write | AES-256 + ECC, public-key | High-security transit, access, ID |
| NTAG 210 / 212 | NXP | ISO 14443A · NFC Type 2 | 48 / 128 B | Read/Write | Basic mass-market NFC | Retail, gaming, publishing |
| NTAG 213 / 215 / 216 | NXP | NFC Type 2 | 144 / 504 / 888 B | Read/Write | Password, UID mirror, TagTamper | NFC marketing, engagement, digital passport |
| NTAG 424 DNA / TagTamper | NXP | ISO 14443-4 · NFC Type 4 | 416 B | Read/Write | AES-128, SUN, CC-certified | Anti-counterfeit, secure authentication |
| NTAG 223 / 224 DNA | NXP | NFC Type 2/4 | user memory | Read/Write | AES-128, SUN, tamper sensing | Trusted IoT, healthcare, tamper detection |
| NTAG 5 / NTAG I2C plus | NXP | ISO 15693 / NFC Type 5 + I2C | up to 8 KB | Read/Write | I2C bridge, energy harvesting | IoT pairing, sensors, consumer electronics |
| NTAG X DNA | NXP | ISO 14443-4 + I2C, VHBR | secure EEPROM | Read/Write | CC EAL6+, PKI / ECC | Device / consumable authentication |
| ICODE SLIX / SLIX2 / SLI-L / DNA | NXP | ISO 15693 · NFC Type 5 | 128 B – 2560-bit | Read/Write | Long range; DNA adds AES-128 | Library, item-level retail, supply chain |
| ST25TA | ST | ISO 14443A · NFC Type 4 | 512 b – 64 kb | Read/Write | Password, ~200-yr retention | Consumer NFC, product information |
| ST25TN / ST25TV | ST | ISO 15693 · NFC Type 5 | 512 b – 64 kb | Read/Write | TruST25 signature, tamper-detect | Brand protection, wine/pharma, ESL |
| ST25DV (dynamic NFC) | ST | ISO 15693 · NFC Type 5 + I2C | 4 – 64 kb | Read/Write | Energy harvesting, mailbox | IoT, ESL, industrial, metering |
| ST25TB / SRIX4K | ST | ISO 14443B | 512 b – 4 kb | Read/Write | Anti-tearing, transport-optimized | Transit ticketing, event access |
| EM4233 / EM4237 | EM Micro | ISO 15693 · NFC Type 5 | up to 2 kbit | Read/Write | Anti-collision, EAS | Library, asset, ticketing |
| my-d move NFC (SLE 66R) | Infineon | ISO 14443 / 15693 · NFC | up to 10 kbit | Read/Write | Configurable, secure options | Ticketing, access, IoT |
| FM11RF08 / RF08S / RF32 | Fudan | ISO 14443A | 1 / 4 KB | Read/Write | MIFARE Classic-compatible | Transit, access, campus (cost-driven) |
| FM1108 / FM11RF005 | Fudan | ISO 14443A · NFC Type 2 | 1 KB / Ultralight-class | Read/Write | MIFARE Classic / Ultralight compat. | Access, disposable tickets |
| LEGIC advant / prime | LEGIC | ISO 14443 / 15693 | up to 64 kB | Read/Write | Proprietary AES / DES, managed keys | High-security access, closed systems |
| Tag-it HF-I (RF-HDT) | Texas Instr. | ISO 15693 · NFC Type 5 | 256 b – 2 kb | Read/Write | Legacy vicinity tag | Library, laundry (legacy) |
| UHF / RAIN · 860–960 MHz — Long-Range Access & Asset | ||||||
| Monza 4 (4D / 4E / 4QT / 4iL) | Impinj | EPC Gen2v2 · ISO 18000-63 | up to 512-bit user | Read/Write | AutoTune, QT public/private | Retail, supply chain, general purpose |
| Monza R6 / R6-P / R6-A | Impinj | EPC Gen2v2 | 32–96-bit user | Read/Write | AutoTune adaptive tuning | Retail apparel, logistics, hospitality |
| Monza X-2K / X-8K DURA | Impinj | EPC Gen2 + I2C | 2 / 8 kbit | Read/Write | Battery-assist, embedded IoT | Equipment mgmt, cold chain, IoT sensors |
| M700 (M730 / M750 / M770 / M775) | Impinj | EPC Gen2v2 | 32-bit user, 128-bit EPC | Read/Write | −22 to −24 dBm, high throughput | Retail, logistics, high-density inventory |
| M700 expanded (M780 / M781) | Impinj | EPC Gen2v2 | larger user memory | Read/Write | Extended item-attribute storage | Pharma, food, automotive (batch/date) |
| M800 (M810 / M830 / M850) | Impinj | EPC Gen2v2 / Gen2X | up to 32-bit user | Read/Write | −25.5 dBm, AutoTune V3 | High-speed inventory, difficult environments |
| UCODE 7 / 7m / 7xm | NXP | EPC Gen2v2 · ISO 18000-63 | up to 2 kbit user | Read/Write | High sensitivity, pre-serialized EPC | Retail, brand protection |
| UCODE 8 / 8m | NXP | EPC Gen2v2 | 128-bit EPC / user option | Read/Write | Self-adjust tuning | Retail apparel, logistics |
| UCODE 9 / 9xe / 9xm | NXP | EPC Gen2v2 | 96–496-bit EPC, up to 128 user | Read/Write | −24 dBm, self-adjust, mini die | Retail, food, logistics |
| UCODE DNA / DNA City / DNA Track | NXP | EPC Gen2v2 | user memory | Read/Write | AES-128 authentication | Secure supply chain, tolling, brand protection |
| UCODE G2iM / G2iM+ (legacy) | NXP | EPC Gen2 | up to 512-bit user | Read/Write | Configurable memory | Industrial, asset (legacy) |
| Higgs-3 (H3) | Alien | EPC Gen2v2 · ISO 18000-63 | 800-bit (512 user) | Read/Write | Large user memory, versatile | Baggage, laundry, manufacturing genealogy |
| Higgs-4 (H4) | Alien | EPC Gen2v2 | 448-bit (128 user) | Read/Write | Small die, high-volume | Apparel hang tags, retail |
| Higgs-EC | Alien | EPC Gen2v2 | 480-bit (32 user) | Read/Write | High R/W sensitivity, IoT | General high-volume, IoT |
| Higgs-9 (H9) | Alien | EPC Gen2v2 | 1024-bit (688 user) | Read/Write | High memory + performance | High-memory asset, offline data |
| EM4124 / EM4126 | EM Micro | EPC Gen2 · ISO 18000-63 | 96–496 EPC / 512-bit user | Read/Write | Passive Gen2 | Logistics, asset tracking |
| EM4325 | EM Micro | EPC Gen2v2 + ISO 18000-64, SPI | 4 kbit | Read/Write | Battery-assist, temp sensor | Cold chain, sensing, aerospace logistics |
| QR2233 / eStar series | Quanray | EPC Gen2v2 | up to 512-bit user | Read/Write | Low-cost domestic Gen2 | Retail, apparel (cost-driven) |
| FM13UF / UHF series | Fudan | EPC Gen2v2 | varies by part | Read/Write | Domestic Gen2 | Logistics, asset |
| Magnus S3 sensor IC | Axzon | EPC Gen2 + sensor | sensor + user memory | Read/Write | On-chip moisture / temp sensing | Sensing, moisture, medical / industrial |
| Dual-Frequency — HF + UHF in One Card | ||||||
| EM4423 | EM Micro | ISO 15693/NFC Type 5 + EPC Gen2v2 | shared user memory | Read/Write | HF+UHF single die, shared UID | Smart packaging, brand protection + logistics |
| EM4425 (em|echo-V) | EM Micro | NFC Type 5 + EPC Gen2v2 | 2048-bit shared | Read/Write | AES-128, digital signature | Retail, authentication, consumer engagement |
| LF + HF combo card | Multi-vendor | 125 kHz + ISO 14443A | per embedded chip | Mixed | Two independent chips | LF→HF migration bridge card |
CPU / Secure Microprocessor Chips (Contact IC · Contactless · Dual-Interface)
Contact IC / CPU option for Teslin smart cards. Certification is chip-level; product-level payment / ID approvals (EMVCo, Visa, Mastercard, UnionPay, PBOC) are obtained per project. Chinese brands add SM1–SM4 alongside DES / 3DES / RSA / ECC / AES.
| Brand | Part Number | Memory | Certification | Cross-Reference (Intl. ↔ China) | Best For |
|---|---|---|---|---|---|
| Contactless CPU Cards | |||||
| NXP | MIFARE DESFire EV3 — MF3D2301 / MF3D4301 / MF3D8301 (H = MF3DH…) | 2 / 4 / 8 KB NVM | CC EAL5+ | ↔ Fudan FM1208 / FM1280 (RF) | Transit, access, ticketing, micro-payment, smart city |
| NXP | MIFARE DESFire EV2 — MF3Dx2 (2K / 4K / 8K) — legacy | 2 / 4 / 8 KB NVM | CC EAL5+ | ↔ Fudan FM1208 | Transit, ticketing (existing systems) |
| NXP | MIFARE Plus EV2 — MF1P2200 / MF1P4200 (MF1PH…) | 2 / 4 KB | CC EAL5+ | ↔ Fudan FM11RF08 family | Transit, access, closed-loop ticketing |
| NXP | SmartMX3 P71D321 (contactless config) | up to ~150 KB Flash | CC EAL6+, EMVCo | ↔ Unigroup THD89 · Huada CIU9872B | ePassport, eID, contactless bank card |
| Infineon | SLE78CLFX2400P / CLFX4000P / CLFX5000PH (contactless) | 240 / 404 / 528 KB NVM | CC EAL6+, EMVCo | ↔ Unigroup THD89 | eID, ePassport, contactless payment |
| ST | ST31G256 / G320 / G384 / G480 (contactless, MIFARE/Calypso) | 256 / 320 / 384 / 480 KB Flash | CC EAL6+, EMVCo | ↔ Fudan FM1280 · Huada CIU9872B | Transit (Calypso), eID, payment |
| Fudan / FMSH | FM1204 / FM1204M01 (4K CPU, +1K MIFARE) | 4 KB EEPROM (5 KB array) | PBOC 2.0 | ↔ NXP MIFARE Plus | Transit, campus, small-value |
| Fudan / FMSH | FM1208 — FM1208-09 (8K) / FM1208M01 (7K+1K M1) / FM1208-23 (4K+4K S70) | 8 KB EEPROM, 32 KB ROM | PBOC 2.0 (e-wallet) | ↔ NXP DESFire / MIFARE Plus | Transit, campus, highway, micro-payment |
| Fudan / FMSH | FM1280 (contactless config, Java / native COS, VHBR) | up to 64 KB EEPROM | Bank-grade · payment cert. at product level | ↔ NXP SmartMX / Infineon / ST | Social-security, health, transit, citizen card |
| Huada / HED | CIU9872B / CIU9872B_01 (contactless, 32-bit) | 80 KB user memory | CC EAL6+, EMVCo (ICCN0219) | ↔ NXP SmartMX / Infineon | Digital-RMB hard wallet, transit, eID |
| Unigroup Tongxin | THD89 (contactless config) | large-capacity (per code) | CC EAL6+ (SOGIS), EMVCo, SM L2 | ↔ NXP SmartMX / Infineon | ePassport, eID, contactless payment |
| Contact CPU Cards | |||||
| NXP | SmartMX2 — P60C080 / P60C144 (contact) | 80 / 144 KB EEPROM · 384 KB ROM | CC EAL6+, EMVCo | ↔ Unigroup THD88 · Huada CIU98 | Banking, eID, TPM |
| NXP | SmartMX3 — P71D320 / P71D321 (contact config) | up to ~150 KB Flash | CC EAL6+, EMVCo | ↔ Unigroup THD89 · Huada CIU98 | Banking, SIM/UICC, eID |
| Infineon | SLE78CFX2400P / CFX4000P / CFX5000PH | 240 / 404 / 500 KB NVM | CC EAL6+ | ↔ Fudan FM1280 · Huada CIU98 | Banking, ePassport, eID, TPM |
| Infineon | SLE78CAX512SPHM (serial / contact) | 500 KB NVM | CC EAL6+ | ↔ Unigroup THD89 | Secure element, identity, authentication |
| ST | ST33 series (e.g. ST33J2M0 contact) · ST23 legacy | up to 2 MB Flash | CC EAL6+, EMVCo | ↔ Fudan FM1280 · Huada CIU98 | Banking, eSIM, TPM (FIPS-140-3) |
| Samsung | S3FS / S3 secure-MCU series (contact config) | varies by part | CC EAL5+/6+, EMVCo | ↔ Unigroup THD89 | Banking, SIM, identity |
| Fudan / FMSH | FM1216 (16 KB) · FM1232 (32 KB) · FM1280 (≤64 KB) — contact | 16 / 32 / up to 64 KB EEPROM · 64 KB ROM | Bank-grade · SM cert. · EAL4+ (FM1216/1232) | ↔ Infineon / NXP / ST | Social-security, banking, ESAM/PSAM, citizen card |
| Huada / HED | CIU5132A (contact SS) · SHC1302 (banking 32-bit) · CIU98M25 / CIU98M50 (SIM) | SHC1302: 256 KB ROM / 10 KB RAM · CIU98M50: 2.5 MB · CIU98M25: 1.25 MB | CC EAL · payment cert. at product level | ↔ Infineon / NXP | Social-security, banking, super-SIM |
| Unigroup Tongxin | THD88-E48 / E80 / E120 / E160 · THC20 / THC80 (SIM) | ≈48 / 80 / 120 / 160 KB EEPROM | CC EAL5+/6+ · payment cert. at product level | ↔ Infineon / NXP | Banking, SIM/USIM, social-security, eID |
| Datang | DMT-CFN2HG6 | per ordering code | Bank-grade · payment cert. at product level | ↔ Infineon / NXP / ST | Banking, social-security, eHealth |
| Dual-Interface CPU Cards | |||||
| NXP | SmartMX2 — P60D024 / P60D080 / P60D144 / P60D145 | 24 / 80 / 144 KB EEPROM · 384 KB ROM | CC EAL6+, EMVCo | ↔ Unigroup THD89 · Huada CIU9872B | Banking, ePassport, eID, transit |
| NXP | SmartMX3 — P71D320 / P71D321 | up to ~150 KB Flash · RSA 4096 / ECC 640 | CC EAL6+, EMVCo | ↔ Unigroup THD89 · Huada CIU9872B | Banking, ePassport, eID |
| Infineon | SLE78CLFX2400P / CLFX4000P (400VP) / CLFX5000PH / CLFX6280PH | 240 / 404 / 528 / 628 KB NVM | CC EAL6+, EMVCo | ↔ Unigroup THD89 · Huada CIU9872B | Banking, eID, ePassport, transit |
| ST | ST31G256 / G320 / G384 / G480 · ST31P320 / P450 | 256 / 320 / 384 / 480 KB · 320 / 450 KB Flash | CC EAL6+, EMVCo | ↔ Fudan FM1280 · Huada CIU9872B | Banking, transit, eID, biometric card |
| Samsung | S3 dual-interface secure-MCU series | varies by part | CC EAL5+/6+, EMVCo | ↔ Unigroup THD89 | Banking, identity, fingerprint card |
| Fudan / FMSH | FM1232 (32 KB) · FM12CD32 · FM1280 (≤64 KB) — Java / native COS | 32 / up to 64 KB EEPROM | Bank-grade · EAL4+ (FM1232) · payment cert. at product level | ↔ Infineon / NXP / ST | Banking, social-security, transit, health, citizen card |
| Huada / HED | CIU9872B / CIU9872B_01 (32-bit CPU) | 80 KB user memory | CC EAL6+, EMVCo (ICCN0219) | ↔ NXP SmartMX / Infineon / ST | Banking, digital-RMB wallet, ePassport |
| Unigroup Tongxin | THD89 (1.0.1 series, EMV one-chip dual-app) | large-capacity (per code) | CC EAL6+ (SOGIS), EMVCo, SM L2, AEC-Q100 | ↔ NXP SmartMX / Infineon / ST | Banking (domestic+intl), eID, eUICC, social-security |
| Datang | DMT-CBS-CE3D | up to 128 KB EEPROM | Bank-grade · payment cert. at product level | ↔ Infineon / NXP / ST | Banking, eHealth, social-security |
| Nationz | Z32 secure-MCU series | per ordering code | CC EAL · SM L2 · payment cert. at product level | ↔ NXP / Infineon | Banking, identity, IoT secure element |
No chips match your filter. Try a brand (NXP, Fudan, Unigroup), a part (FM1280, NTAG 424, THD89) or an application (access, transit, banking).
Part numbers are product-family / ordering codes; exact memory, package and delivery format are confirmed per project. Crypto-1 (MIFARE Classic-class) is legacy — for new secure deployments we recommend MIFARE Plus / DESFire, NTAG 424 DNA or ICODE DNA. CPU cards are not pin-for-pin drop-ins; migration is at the COS / personalization layer. Chip availability and specifications may change; confirm current status before design-in.
Where Teslin Cards Are Used
National ID Cards
Secure, long-life ID cards for national programs.
- High-definition photo and data printing
- Tamper-evident security material
- Optional embedded RFID or contact chip
Driver's Licenses
Durable license cards for daily handling.
- Abrasion- and moisture-resistant
- Sharp portrait and security printing
- Magnetic stripe or chip options
e-Passport e-Covers
Secure document covers for e-passports.
- Protects embedded chip and antenna
- Specified in national e-passport programs
- Strong lamination and durability
RFID Cards & Tags
Reliable RFID cards and tags for access.
- Cushions and protects RFID inlays
- HF, NFC, UHF or contact IC chips
- Card and key-fob form factors
Access Credentials
Secure staff badges for building access.
- Encoded with UID for staff entry
- Durable for daily tap-and-go use
- Photo and role printing
Membership Cards
Premium membership cards for clubs and programs.
- Vivid, high-clarity brand printing
- Optional RFID or NFC for check-in
- Long-lasting for repeated use
Frequently Asked Questions
What is a Teslin card, and what is Teslin made of?
A Teslin card is built on Teslin, a single-layer, microporous synthetic substrate engineered for secure credentials and embedded electronics. It is valued for high print definition, a strong lamination bond, durability and tamper-evident behavior, which is why it is widely specified for national ID, driver licenses and e-passport programs. It is a security-grade card material rather than a standard PVC plastic.
Can Teslin cards include RFID, NFC or contact chips?
Yes. Teslin cards can be built with HF 13.56 MHz, NFC, UHF 860–960 MHz or contact IC and secure CPU chips, and dual-interface options are available. The microporous structure cushions and protects embedded inlays, chips and antennas, which makes Teslin especially suitable for e-passport e-covers and secure RFID credentials. The exact chip is selected to match your readers and security requirements.
Teslin vs PVC vs PET — which ID card material should I choose?
PVC is the common, cost-effective card plastic. PET is stiffer and more heat-resistant. Teslin is a microporous synthetic substrate that leads on print definition, lamination bond, durability and tamper-evident security, making it the preferred choice for national ID, driver licenses and e-passport programs. We can help you choose based on security level, lifespan and printing needs.
What are the MOQ, sizes, finishes and lead time for custom Teslin cards?
Cards are available in CR80 or custom sizes and structures, with photo ID printing, variable data, signature panel and optional magnetic stripe. We support OEM / ODM projects including artwork, numbering, encoding and chip selection. Contact our team with your quantity, chip and artwork requirements for exact MOQ, lead time and a project-based quote.
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View DetailsStart Your Secure Teslin Card Project
Running a national ID, driver license, e-passport or access-credential program? Tell us your required chip, security features and volumes, and our team will handle substrate selection, secure printing, encoding and lamination — then quote your project. Not sure whether Teslin, PVC or PET fits your security and durability targets? We'll help you specify the right material before you commit.