Contact CPU Card | ISO/IEC 7816 Java Card Smart Card
Secure Microprocessor Smart Card for Payment, Identity, PKI and Access Applications
CedaGlo contact CPU cards integrate a secure microprocessor, protected memory and ISO/IEC 7816 contact interface to support encrypted data processing, multi-application card systems and secure personalization for B2B projects.
- 🛡️High
Security - 💳ISO/IEC
7816 - ⚙️Java Card /
GlobalPlatform - 🧩Multi-
Application
Contact CPU Smart Card Overview
Our contact CPU smart card is an ISO/IEC 7816 smart card that integrates a secure microprocessor, operating system and protected memory to deliver strong security and flexible application support. As a secure microprocessor card, it is widely used for authentication, payment, identity management, PKI, access control and secure data processing. Compatible with Java Card smart card platforms and GlobalPlatform-based card management, it is ideal for EMV contact card applications, government ID projects, enterprise login systems and other mission-critical environments.
CedaGlo can supply blank contact CPU cards, printed CPU smart cards, magnetic stripe CPU cards, barcode / QR code CPU cards, signature-panel smart cards and personalized card solutions according to selected chip platform, COS, EEPROM size, card body material and issuance requirements.
Project Requirements
High data and key security for payment, identity, PKI and access applications.
Stable interoperability with ISO/IEC 7816 readers, APDU commands and host systems.
Flexible chip and COS options for Java Card, GlobalPlatform, native COS or proprietary card OS projects.
Reliable endurance and data retention for long lifecycle deployments.
Support for personalization, applet loading, encoding, printing and secure card issuance.
Why Choose CedaGlo Contact CPU Cards
Secure chip platform options
Supports mainstream secure MCU platforms from multiple chip ecosystems, including international and China domestic CPU card IC options.
ISO/IEC 7816 compliant card production
Stable contact communication with APDU support and broad reader compatibility for banking, ID, PKI and access systems.
Flexible OS / COS choices
Optional Java Card, GlobalPlatform, proprietary COS or native COS solutions depending on project requirements.
Cryptographic capability
Supports DES, 3DES, AES, RSA, ECC, SHA and SM algorithm options depending on selected chip and COS.
Custom card manufacturing
Card body, printing, encoding, UID / serial number, barcode, QR code, laser engraving, magnetic stripe and packaging services are available for project rollout.
Application Advantages
Banking & EMV Payment
Secure transaction processing, strong chip security and reliable contact interface for payment card projects.
Government ID & PKI
Secure identity authentication, certificate storage and digital signature support for government and public-sector projects.
Enterprise Access & Authentication
Employee identity verification, logical login and physical access control using secure contact smart cards.
Healthcare / Social Security
Protected personal data, stable long-term use and multi-service card support for healthcare and social security programs.
Campus & Membership Systems
One card can support identity, access, stored-value and membership management in closed-loop environments.
Key Technical Highlights
- 🛡️Secure microcontroller architecture with protected memory and hardware security mechanisms.
- 🪪Supports ISO/IEC 7816 contact interface and T=0 / T=1 APDU communication protocol.
- ⚙️Optional Java Card / GlobalPlatform compatibility for applet-based multi-application deployment.
- 🔐Cryptographic options include DES, 3DES, AES, RSA, ECC, SHA and SM algorithms depending on chip platform.
- ✅Optional Common Criteria security levels such as EAL5+ / EAL6+ depending on selected chip and certification target.
- 🏷️Suitable for secure personalization, UID / serial number management and card issuance workflows.
Technical Specifications
| Parameter | Specification |
|---|---|
| Card Type | Contact CPU Smart Card |
| Interface | ISO/IEC 7816 contact interface |
| Communication Protocol | T=0 / T=1 APDU |
| Typical Chip Options | NXP SmartMX / JCOP, Infineon SLE78 / SECORA, ST ST31 / ST33, Fudan FM1216 / FM12CD32 / FM1280, Huada CIU98 series, Unigroup THD88 / THD89, Datang DMT series, or equivalent |
| Operating System Options | Java Card, GlobalPlatform, proprietary COS, PKI / payment applets depending on project |
| User Memory / EEPROM | Typical options from 16 KB to 80 KB+ depending on chip |
| ROM / Flash | Chip-dependent secure MCU architecture |
| RAM | Chip-dependent |
| Security Features | Secure microcontroller, hardware cryptography, secure key storage, anti-tamper mechanisms depending on chip |
| Cryptographic Algorithms | DES / 3DES / AES / RSA / ECC / SHA / SM algorithms depending on chip and project region |
| Security Certification | Common Criteria EAL5+ / EAL6+ options depending on chip |
| Write Endurance | Typically 100,000 to 500,000 cycles depending on chip |
| Data Retention | Typically 10 to 25 years depending on chip |
| Operating Temperature | Typical -25°C to +70°C, chip-dependent |
| Card Size | CR80, 85.60 × 53.98 mm |
| Thickness | 0.76 mm standard |
| Card Materials | PVC / PET / PETG / ABS optional |
| Personalization | CMYK printing, UID / serial number, barcode, QR code, laser engraving, embossing, signature panel, magnetic stripe optional |
| Recommended Applications | Banking, government ID, PKI, enterprise authentication, healthcare, social security, membership and secure access |
Specification note: Exact parameters vary by selected chip platform, COS, certification target, personalization process and project requirements.
Volume Pricing
| Quantity | Unit Price (USD / pc) |
|---|---|
| 100 – 199 pcs | From US$1.00 |
| 200 – 299 pcs | From US$0.80 |
| 300+ pcs | Contact our sales team for project pricing |
Pricing note: Final price depends on chip platform, COS / applet requirements, printing, personalization, encoding and order quantity. Please contact CedaGlo for an exact project quotation.
CPU Card Chip Selection Guide
Supported CPU card chip platforms include NXP SmartMX2, NXP SmartMX3, P60C080, P60C144, P60D024, P60D080, P60D144, P60D145, P71D320, P71D321, Infineon SLE78CFX2400P, SLE78CFX4000P, SLE78CFX5000PH, SLE78CLFX2400P, SLE78CLFX4000P, SLE78CLFX5000PH, SLE78CLFX6280PH, ST31G256, ST31G320, ST31G384, ST31G480, ST33J2M0, Fudan FM1204, FM1208, FM1216, FM1232, FM12CD32, FM1280, Huada CIU9872B, CIU5132A, SHC1302, CIU98M25, CIU98M50, Unigroup Tongxin THD88, THD89, THD88-E80, THD88-E120, THD88-E160, Datang DMT-CFN2HG6, DMT-CBS-CE3D and other contact, contactless and dual-interface CPU card IC solutions.
CPU card migration is project-level — it depends on chip, COS, applet, memory, algorithm, personalization and certification, not a pin-for-pin swap like a basic memory IC. Many secure-MCU platforms ship in contact / contactless / dual configurations from one die, so the same family can appear under more than one interface category below. China-brand chips add SM1–SM4 algorithms alongside international DES/3DES/RSA/ECC/AES.
Buyer Notes
- Part numbers shown are platform / family ordering codes — the suffix encodes package, ROM/Flash split and options; confirm the exact code and current availability before design-in.
- Memory figures vary by how each brand quotes it (EEPROM only vs. EEPROM+ROM vs. total Flash/NVM); “up to” values are platform maxima, not guaranteed per-part capacity.
- Fixed-function contactless ICs (MIFARE DESFire, Fudan FM1204/FM1208) suit transit and access; larger parts are open Java / native-COS platforms for banking, ID and multi-application projects.
- China equivalents are functional matches, not pin-for-pin — Huada CIU9872B holds EMVCo (cert. ICCN0219), Unigroup THD89 holds SOGIS CC EAL6+; product-level payment/ID certification (EMVCo, Visa, Mastercard, UnionPay, PBOC) is still obtained per project.
Wide reference tables below — scroll horizontally on desktop, or view as stacked cards on mobile.
Contactless CPU Cards
| Brand | Part Number (orderable) | On-chip Memory | Certification | Cross-Reference (Intl. ↔ China) | Application |
|---|---|---|---|---|---|
| NXP | MIFARE DESFire EV3 — MF3D2301 / MF3D4301 / MF3D8301 (H = high-cap variant: MF3DH…) | 2 / 4 / 8 KB NVM | CC EAL5+ | ↔ Fudan FM1208 / FM1280 (RF use-case) | Transit, access, ticketing, micro-payment, smart city |
| NXP | MIFARE DESFire EV2 — MF3Dx2 (2K / 4K / 8K) — legacy, replaced by EV3 | 2 / 4 / 8 KB NVM | CC EAL5+ | ↔ Fudan FM1208 (use-case) | Transit, ticketing (existing systems) |
| NXP | MIFARE Plus EV2 — MF1P2200 / MF1P4200 (H-variant MF1PH…) | 2 / 4 KB | CC EAL5+ | ↔ Fudan FM11RF08 family (upgrade path) | Transit, access, closed-loop ticketing |
| NXP | SmartMX3 P71D321 (contactless configuration) | up to ~150 KB Flash | CC EAL6+, EMVCo | ↔ Unigroup THD89 · Huada CIU9872B | ePassport, eID, contactless bank card |
| Infineon | SLE78CLFX2400P / CLFX4000P / CLFX5000PH (contactless config) | 240 / 404 / 528 KB NVM | CC EAL6+, EMVCo | ↔ Unigroup THD89 | eID, ePassport, contactless payment |
| STMicroelectronics | ST31G256 / G320 / G384 / G480 (contactless config, MIFARE/Calypso) | 256 / 320 / 384 / 480 KB Flash | CC EAL6+, EMVCo | ↔ Fudan FM1280 · Huada CIU9872B | Transit (Calypso), eID, payment |
| Fudan / FMSH | FM1204 / FM1204M01 (4K CPU, +1K MIFARE option) | 4 KB EEPROM (5 KB array) | PBOC 2.0 | ↔ NXP MIFARE Plus (use-case) | Transit, campus, small-value |
| Fudan / FMSH | FM1208 — FM1208-09 (8K) / FM1208M01 (7K+1K M1) / FM1208-23 (4K+4K S70) | 8 KB EEPROM, 32 KB ROM | PBOC 2.0 (e-wallet) | ↔ NXP DESFire / MIFARE Plus | Transit, campus, highway, micro-payment |
| Fudan / FMSH | FM1280 (contactless configuration, Java / native COS, VHBR) | up to 64 KB EEPROM | Bank-grade secure chip · payment cert. at product level | ↔ NXP SmartMX / Infineon / ST | Social-security, health, transit, citizen card |
| Huada / HED | CIU9872B / CIU9872B_01 (contactless configuration, 32-bit) | 80 KB user memory | CC EAL6+, EMVCo (ICCN0219) | ↔ NXP SmartMX / Infineon | Digital-RMB hard wallet, transit, eID |
| Unigroup Tongxin | THD89 (contactless configuration) | large-capacity (per ordering code) | CC EAL6+ (SOGIS), EMVCo, SM L2 | ↔ NXP SmartMX / Infineon | ePassport, eID, contactless payment |
Contact CPU Cards
| Brand | Part Number (orderable) | On-chip Memory | Certification | Cross-Reference (Intl. ↔ China) | Application |
|---|---|---|---|---|---|
| NXP | SmartMX2 — P60C080 / P60C144 (contact) | 80 / 144 KB EEPROM · 384 KB ROM | CC EAL6+, EMVCo | ↔ Unigroup THD88 · Huada CIU98 | Banking, eID, TPM |
| NXP | SmartMX3 — P71D320 / P71D321 (contact configuration) | up to ~150 KB Flash | CC EAL6+, EMVCo | ↔ Unigroup THD89 · Huada CIU98 | Banking, SIM/UICC, eID |
| Infineon | SLE78CFX2400P / CFX4000P / CFX5000PH | 240 / 404 / 500 KB NVM | CC EAL6+ | ↔ Fudan FM1280 · Huada CIU98 | Banking, ePassport, eID, TPM |
| Infineon | SLE78CAX512SPHM (serial / contact) | 500 KB NVM | CC EAL6+ | ↔ Unigroup THD89 | Secure element, identity, authentication |
| STMicroelectronics | ST33 series (e.g. ST33J2M0 contact config) · ST23 legacy | up to 2 MB Flash | CC EAL6+, EMVCo | ↔ Fudan FM1280 · Huada CIU98 | Banking, eSIM, TPM (FIPS-140-3) |
| Samsung | S3FS / S3 secure-MCU series (contact config) | varies by part | CC EAL5+/6+, EMVCo | ↔ Unigroup THD89 | Banking, SIM, identity |
| Fudan / FMSH | FM1216 (16 KB) · FM1232 (32 KB) · FM1280 (≤64 KB) — contact config | 16 / 32 / up to 64 KB EEPROM · 64 KB ROM | Bank-grade · SM cert. · EAL4+ (FM1216/1232) | ↔ Infineon / NXP / ST | Social-security, banking, ESAM/PSAM, citizen card |
| Huada / HED | CIU5132A (contact SS) · SHC1302 (banking, 32-bit SC100) · CIU98M25 / CIU98M50 (SIM) | SHC1302: 256 KB ROM / 10 KB RAM · CIU98M50: 2.5 MB · CIU98M25: 1.25 MB Flash | CC EAL · payment cert. at product level | ↔ Infineon / NXP | Social-security, banking, super-SIM |
| Unigroup Tongxin | THD88-E48 / E80 / E120 / E160 · THC20 / THC80 (SIM) | ≈48 / 80 / 120 / 160 KB EEPROM | CC EAL5+/6+ · payment cert. at product level | ↔ Infineon / NXP | Banking, SIM/USIM, social-security, eID |
| Datang | DMT-CFN2HG6 | per ordering code | Bank-grade · payment cert. at product level | ↔ Infineon / NXP / ST | Banking, social-security, eHealth |
Dual-Interface CPU Cards
| Brand | Part Number (orderable) | On-chip Memory | Certification | Cross-Reference (Intl. ↔ China) | Application |
|---|---|---|---|---|---|
| NXP | SmartMX2 — P60D024 / P60D080 / P60D144 / P60D145 | 24 / 80 / 144 KB EEPROM · 384 KB ROM | CC EAL6+, EMVCo | ↔ Unigroup THD89 · Huada CIU9872B | Banking, ePassport, eID, transit |
| NXP | SmartMX3 — P71D320 / P71D321 | up to ~150 KB Flash · RSA 4096 / ECC 640 | CC EAL6+, EMVCo | ↔ Unigroup THD89 · Huada CIU9872B | Banking, ePassport, eID |
| Infineon | SLE78CLFX2400P / CLFX4000P (400VP) / CLFX5000PH / CLFX6280PH | 240 / 404 / 528 / 628 KB NVM | CC EAL6+, EMVCo | ↔ Unigroup THD89 · Huada CIU9872B | Banking, eID, ePassport, transit |
| STMicroelectronics | ST31G256 / G320 / G384 / G480 · ST31P320 / P450 | 256 / 320 / 384 / 480 KB · 320 / 450 KB Flash | CC EAL6+, EMVCo | ↔ Fudan FM1280 · Huada CIU9872B | Banking, transit, eID, biometric card |
| Samsung | S3 dual-interface secure-MCU series | varies by part | CC EAL5+/6+, EMVCo | ↔ Unigroup THD89 | Banking, identity, fingerprint card |
| Fudan / FMSH | FM1232 (32 KB) · FM12CD32 · FM1280 (≤64 KB) — Java / native COS | 32 / up to 64 KB EEPROM | Bank-grade · EAL4+ (FM1232) · payment cert. at product level | ↔ Infineon / NXP / ST | Banking, social-security, transit, health, citizen card |
| Huada / HED | CIU9872B / CIU9872B_01 (32-bit CPU) | 80 KB user memory | CC EAL6+, EMVCo (ICCN0219) | ↔ NXP SmartMX / Infineon / ST | Banking, digital-RMB wallet, ePassport |
| Unigroup Tongxin | THD89 (THD89 1.0.1 series, EMV one-chip dual-app) | large-capacity (per ordering code) | CC EAL6+ (SOGIS), EMVCo, SM L2, AEC-Q100 | ↔ NXP SmartMX / Infineon / ST | Banking (domestic+intl), eID, eUICC, social-security |
| Datang | DMT-CBS-CE3D | up to 128 KB EEPROM | Bank-grade · payment cert. at product level | ↔ Infineon / NXP / ST | Banking, eHealth, social-security |
| Nationz | Z32 secure-MCU series | per ordering code | CC EAL · SM L2 · payment cert. at product level | ↔ NXP / Infineon | Banking, identity, IoT secure element |
Cross-Reference — International ↔ China CPU Card Chips
| Interface | Intl. Part (Brand) | Intl. Origin | China Equivalent (Brand · Part) | Match Type | Security Level |
|---|---|---|---|---|---|
| Contactless | MIFARE DESFire EV3 MF3D8301 (NXP) | EU | Fudan FM1208-09 / FM1280 (RF) | Functional equiv. | CC EAL5+ |
| Contactless | SmartMX3 P71D321 (NXP) | EU | Unigroup THD89 / Huada CIU9872B | Functional equiv. | CC EAL6+ |
| Contact | SmartMX2 P60C080 / P60C144 (NXP) | EU | Unigroup THD88-E80 / Fudan FM1280 | Functional equiv. | CC EAL6+ |
| Contact | SLE78CFX4000P (Infineon) | EU | Fudan FM1280 / Huada SHC1302 | Functional equiv. | CC EAL6+ |
| Contact | ST33J2M0 (ST) | EU | Fudan FM1280 / Unigroup THD88 | Functional equiv. | CC EAL6+ |
| Dual | SmartMX2 P60D080 / SmartMX3 P71D320 (NXP) | EU | Unigroup THD89 / Huada CIU9872B | Functional equiv. | CC EAL6+ |
| Dual | SLE78CLFX5000PH (Infineon) | EU | Unigroup THD89 / Huada CIU9872B | Functional equiv. | CC EAL6+ |
| Dual | ST31G480 / ST31P320 (ST) | EU | Fudan FM1232 / Huada CIU9872B | Functional equiv. | CC EAL5+/6+ |
- Functional equivalent = same use-case & security level; card OS, applets and payment/ID certification are handled by the issuer per project (standard for any CPU-card change).
- Security Level = Common Criteria EAL at chip/platform level. THD89 (Unigroup) holds SOGIS CC EAL6+; CIU9872B (Huada) holds EMVCo cert. ICCN0219; most EU platforms are CC EAL6+ with EMVCo.
- CPU cards are not pin-for-pin drop-ins — migration is at the OS/personalization layer, not the hardware layer.
Protocols & Compatibility
ISO/IEC 7816
Contact interface and APDU communication for standard contact smart card readers.
T=0 / T=1
Common transmission protocols for CPU smart card communication.
Java Card
Optional applet-based platform for multi-application card deployment.
GlobalPlatform
Optional card content management and secure applet loading framework.
EMV / Payment Projects
Available depending on chip, COS, certification and issuer requirements.
PKI / Digital Signature
Supports certificate storage and secure authentication projects depending on COS.
Application Scenarios
Banking and EMV Contact Cards
CedaGlo contact CPU cards can be configured for EMV contact card and payment-related projects where chip platform, COS, issuer personalization and certification requirements are confirmed before production.
Government ID, Citizen Cards & PKI
Secure microprocessor cards for government ID, citizen card and public service systems requiring protected data, authentication and long-term lifecycle management.
Enterprise Access and Employee Authentication
Contact CPU smart cards can combine employee ID printing, access control, secure login, serial number management and optional magnetic stripe or barcode personalization.
Healthcare and Social Security Cards
CPU cards provide secure memory, cryptographic functions and project-level personalization for healthcare identity, social security and multi-service card programs.
Frequently Asked Questions
What is a contact CPU card?
A contact CPU card is a microprocessor-based smart card that communicates through an ISO/IEC 7816 contact chip interface. Compared with simple memory cards, it can run a card operating system, process APDU commands and support secure authentication or payment applications.
Can CedaGlo supply ISO 7816 Java Card or JCOP-compatible cards?
Yes. CedaGlo can supply contact CPU card solutions based on Java Card, GlobalPlatform, JCOP-type platforms or proprietary COS options, depending on chip availability, certification target and project requirements.
Which chip platforms can be used for contact CPU smart cards?
Typical chip options include NXP SmartMX / JCOP, Infineon SLE78 / SECORA, ST ST31 / ST33, Fudan FM1216 / FM1280, Huada CIU98 series, Unigroup THD88 / THD89 and Datang DMT series. The final chip should be confirmed according to memory size, algorithms, COS and certification requirements.
Is a CPU card the same as SLE4442 or SLE4428 memory card?
No. SLE4442 / SLE4428 cards are commonly used contact memory cards, while CPU cards integrate a secure microprocessor and operating system. CPU cards are more suitable for PKI, payment, secure ID and multi-application projects.
Can you personalize the cards before shipment?
Yes. Available personalization options include offset or digital printing, UID or serial number, barcode, QR code, laser engraving, embossing, signature panel, magnetic stripe, encoding, applet loading and project packaging.
How should I choose between contact, contactless and dual-interface CPU cards?
Contact cards are suitable for ISO 7816 reader systems and secure terminal insertion. Contactless CPU cards are used for fast tap applications such as transit or access. Dual-interface cards are used when one chip must support both contact and contactless interactions.
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View DetailsBuild Your Contact CPU Card Project with CedaGlo
Tell us your chip platform, COS, memory size, certification target, printing artwork and personalization requirements. Our team will recommend a suitable CPU card configuration and provide a project-based quotation.