Dual-Interface CPU Card | ISO 7816 & ISO 14443 Hybrid Smart Card
Secure Contact and Contactless Smart Card for Payment, Transit, Government ID and Enterprise Access
CedaGlo dual-interface CPU cards integrate a single secure microcontroller with both ISO/IEC 7816 contact and ISO/IEC 14443 contactless interfaces, enabling one card to support EMV payment, transit ticketing, government eID and enterprise access — with the same security level and application logic across both interfaces.
- 🛡️High
Security - 🔗ISO/IEC 7816 +
ISO/IEC 14443 - ⚙️Java Card /
GlobalPlatform - 🧩Multi-
Application
Product Overview — Dual-Interface CPU Smart Card
A dual-interface CPU card integrates a single secure microcontroller with two physical interfaces on one chip: an ISO/IEC 7816 contact interface and an ISO/IEC 14443 contactless interface. Both interfaces access the same secure chip, memory and application logic, so the same card can be inserted into a contact reader or tapped on a contactless terminal without maintaining two separate card bodies. CedaGlo supplies custom dual-interface CPU cards with chip selection, card body production, printing, encoding and project support according to your reader infrastructure and application requirements.
Dual-Interface CPU Card — Project Requirements
🔗 Interface Flexibility
Support both contact (ISO/IEC 7816) and contactless (ISO/IEC 14443) infrastructure with a single card body.
🔒 Security Upgrade
Use CPU-based secure chips with COS, encrypted files and mutual authentication for stronger protection than memory cards.
📋 Multi-Application Use
Support payment, transit, ID, access and membership applications in one card architecture across both interfaces.
🖨️ Personalization
CMYK printing, UID/serial number, QR/barcode, laser engraving and data personalization all available.
📜 Certification Path
Chip-level and platform-level certifications vary by chip. Payment or ID scheme approvals are confirmed per project and issuing requirement.
Why Choose CedaGlo Dual-Interface CPU Cards
True Dual-Interface Architecture
One secure chip serves both contact and contactless interfaces with consistent security and application logic.
CPU + COS Flexibility
Choose Java Card, native COS or project-specific operating system options depending on issuer requirements.
Chip Platform Choice
Support for NXP, Infineon, ST, Fudan, Huada, Unigroup and equivalent secure MCU platforms according to availability and certification needs.
Custom Card Manufacturing
PVC, PET, PETG or ABS card bodies can be customized with printing, serial number, barcode, QR code, signature panel or laser engraving.
Project-Level Support
CedaGlo helps match chip, memory, protocol, personalization and delivery requirements before mass production.
Application Advantages
Banking & EMV Payment
Secure dual-interface transactions with reliable contact and contactless performance for payment card projects.
Transit / City Card
Fast tap-and-go fare collection plus secure back-end application support for city and transit card programs.
Government ID & PKI
Secure citizen identity, certificate storage and authentication for government and public-sector projects.
Campus / Enterprise One-Card
One card for identity, access, attendance and payment across campus or enterprise systems.
Key Technical Highlights — Dual-Interface Secure Platform
- 🪪ISO/IEC 7816 Contact Interface
Supports T=0 / T=1 APDU communication for standard contact smart-card readers. - 📶ISO/IEC 14443 Contactless Interface
13.56MHz contactless communication using T=CL protocol when supported by the selected chip and COS. - 🛡️Secure Microcontroller
Designed for on-card processing, encrypted data storage and mutual authentication across both interfaces. - 🔑Cryptographic Support
DES / 3DES / AES / RSA / ECC / SHA / SM algorithms available depending on chip platform and region. - 💾Memory Options
From standard EEPROM configurations to larger Java Card / secure MCU platforms; memory depends on selected chip. - ✏️Personalization Ready
UID printing, serial number, QR code, barcode, encoding and issuer data preparation available by project.
Dual-Interface CPU Card — Technical Specifications
| Parameter | Specification |
|---|---|
| Card Type | Dual-Interface CPU Smart Card |
| Interface | ISO/IEC 7816 contact interface + ISO/IEC 14443 Type A / Type B contactless interface (depends on chip) |
| Communication Protocol | T=0 / T=1 (contact) and T=CL / ISO/IEC 14443-4 (contactless) |
| Contactless Operating Frequency | 13.56 MHz |
| Chip Options | NXP SmartMX2 / SmartMX3 (P60D / P71D series), Infineon SLE78CLFX series, ST31 dual-interface series, Fudan FM1280, Huada CIU9872B, Unigroup THD89 or equivalent |
| Operating System Options | Java Card, GlobalPlatform, native COS, proprietary COS, PKI or payment / transit applet options depending on project |
| User Memory / EEPROM | Typical options from 24 KB to 144 KB+ depending on chip |
| Security Features | Secure microcontroller, hardware cryptography, secure key storage, mutual authentication and anti-tamper mechanisms depending on chip |
| Cryptographic Algorithms | DES / 3DES / AES / RSA / ECC / SHA / SM algorithms depending on chip and project region |
| Security Certification | Common Criteria EAL5+ / EAL6+ options depending on chip; project-level payment / ID certification confirmed separately |
| Write Endurance | Typically 300,000 to 1,000,000 cycles depending on chip |
| Data Retention | Typically 10 to 25 years depending on chip |
| Operating Temperature | Typically -25°C to +70°C, chip-dependent |
| Card Size | CR80, 85.60 × 53.98 mm |
| Thickness | 0.76 mm standard |
| Card Materials | PVC / PET / PETG / ABS optional |
| Personalization | CMYK printing, UID / serial number, barcode, QR code, laser engraving, embossing, signature panel optional |
| Recommended Applications | EMV payment, government ID, transit, campus card, enterprise access, PKI authentication |
Specification note: Exact parameters vary by selected chip platform, COS, certification target, personalization process and project requirements.
Volume Pricing — Dual-Interface CPU Smart Card
| Quantity | Unit Price (USD / pc) |
|---|---|
| 100 – 199 pcs | From US$1.00 |
| 200 – 299 pcs | From US$0.80 |
| 300+ pcs | Contact our sales team for project pricing |
Pricing note: Final price depends on chip platform, COS / applet requirements, printing, personalization, encoding and order quantity. Please contact CedaGlo for an exact project quotation.
Application Scenarios — Dual-Interface CPU Smart Card Use Cases
💳 Banking & EMV Payment
Dual-interface CPU cards can be configured for EMV contact and contactless payment projects where chip platform, COS and issuer certification are confirmed before production.
- Secure transaction logic
- Applet / project dependent
- Reader compatibility check
🚆 Transit & City Card
Fast contactless tap for daily fare collection, with the same chip supporting contact-based back-end verification, top-up or issuance processes.
- Fast tap & anti-cloning
- Durable personalized body
- Stored-value support
🏛️ Government ID & PKI
Secure microprocessor cards for government ID and public service systems requiring protected data, authentication, certificate storage and long-term lifecycle management.
- High security
- Java Card / native COS
- Chip certification selection
🎓 Campus & Enterprise One-Card
Combine access control, identity, attendance and payment into a single dual-interface card for campus and enterprise one-card systems.
- Multi-application support
- Access control & identity
- Flexible encoding options
Chip Platform Selection Guide — Dual-Interface CPU Card Options
CedaGlo’s contact, contactless and dual-interface CPU cards share the same secure-MCU chip ecosystem. Supported CPU card chip platforms include NXP SmartMX2, NXP SmartMX3, P60C080, P60C144, P60D024, P60D080, P60D144, P60D145, P71D320, P71D321, Infineon SLE78CFX2400P, SLE78CFX4000P, SLE78CFX5000PH, SLE78CLFX2400P, SLE78CLFX4000P, SLE78CLFX5000PH, SLE78CLFX6280PH, ST31G256, ST31G320, ST31G384, ST31G480, ST33J2M0, Fudan FM1204, FM1208, FM1216, FM1232, FM12CD32, FM1280, Huada CIU9872B, CIU5132A, SHC1302, CIU98M25, CIU98M50, Unigroup Tongxin THD88, THD89, THD88-E80, THD88-E120, THD88-E160, Datang DMT-CFN2HG6, DMT-CBS-CE3D and other contact, contactless and dual-interface CPU card IC solutions.
CPU card migration is project-level — it depends on chip, COS, applet, memory, algorithm, personalization and certification, not a pin-for-pin swap like a basic memory IC. Many secure-MCU platforms ship in contact / contactless / dual configurations from one die, so the same family can appear under more than one interface category below. China-brand chips add SM1–SM4 algorithms alongside international DES/3DES/RSA/ECC/AES.
Buyer Notes
- Part numbers shown are platform / family ordering codes — the suffix encodes package, ROM/Flash split and options; confirm the exact code and current availability before design-in.
- Memory figures vary by how each brand quotes it (EEPROM only vs. EEPROM+ROM vs. total Flash/NVM); “up to” values are platform maxima, not guaranteed per-part capacity.
- Fixed-function contactless ICs (MIFARE DESFire, Fudan FM1204/FM1208) suit transit and access; larger parts are open Java / native-COS platforms for banking, ID and multi-application projects.
- China equivalents are functional matches, not pin-for-pin — Huada CIU9872B holds EMVCo (cert. ICCN0219), Unigroup THD89 holds SOGIS CC EAL6+; product-level payment/ID certification (EMVCo, Visa, Mastercard, UnionPay, PBOC) is still obtained per project.
Wide reference tables below — scroll horizontally on desktop, or view as stacked cards on mobile.
Contactless CPU Cards
| Brand | Part Number (orderable) | On-chip Memory | Certification | Cross-Reference (Intl. ↔ China) | Application |
|---|---|---|---|---|---|
| NXP | MIFARE DESFire EV3 — MF3D2301 / MF3D4301 / MF3D8301 (H = high-cap variant: MF3DH…) | 2 / 4 / 8 KB NVM | CC EAL5+ | ↔ Fudan FM1208 / FM1280 (RF use-case) | Transit, access, ticketing, micro-payment, smart city |
| NXP | MIFARE DESFire EV2 — MF3Dx2 (2K / 4K / 8K) — legacy, replaced by EV3 | 2 / 4 / 8 KB NVM | CC EAL5+ | ↔ Fudan FM1208 (use-case) | Transit, ticketing (existing systems) |
| NXP | MIFARE Plus EV2 — MF1P2200 / MF1P4200 (H-variant MF1PH…) | 2 / 4 KB | CC EAL5+ | ↔ Fudan FM11RF08 family (upgrade path) | Transit, access, closed-loop ticketing |
| NXP | SmartMX3 P71D321（contactless configuration) | up to ~150 KB Flash | CC EAL6+, EMVCo | ↔ Unigroup THD89 · Huada CIU9872B | ePassport, eID, contactless bank card |
| Infineon | SLE78CLFX2400P / CLFX4000P / CLFX5000PH (contactless config) | 240 / 404 / 528 KB NVM | CC EAL6+, EMVCo | ↔ Unigroup THD89 | eID, ePassport, contactless payment |
| STMicroelectronics | ST31G256 / G320 / G384 / G480 (contactless config, MIFARE/Calypso) | 256 / 320 / 384 / 480 KB Flash | CC EAL6+, EMVCo | ↔ Fudan FM1280 · Huada CIU9872B | Transit (Calypso), eID, payment |
| Fudan / FMSH | FM1204 / FM1204M01 (4K CPU, +1K MIFARE option) | 4 KB EEPROM (5 KB array) | PBOC 2.0 | ↔ NXP MIFARE Plus (use-case) | Transit, campus, small-value |
| Fudan / FMSH | FM1208 — FM1208-09 (8K) / FM1208M01 (7K+1K M1) / FM1208-23 (4K+4K S70) | 8 KB EEPROM, 32 KB ROM | PBOC 2.0（e-wallet） | ↔ NXP DESFire / MIFARE Plus | Transit, campus, highway, micro-payment |
| Fudan / FMSH | FM1280 (contactless configuration, Java / native COS, VHBR) | up to 64 KB EEPROM | Bank-grade secure chip · payment cert. at product level | ↔ NXP SmartMX / Infineon / ST | Social-security, health, transit, citizen card |
| Huada / HED | CIU9872B / CIU9872B_01 (contactless configuration, 32-bit) | 80 KB user memory | CC EAL6+, EMVCo (ICCN0219) | ↔ NXP SmartMX / Infineon | Digital-RMB hard wallet, transit, eID |
| Unigroup Tongxin | THD89 (contactless configuration) | large-capacity (per ordering code) | CC EAL6+ (SOGIS), EMVCo, SM L2 | ↔ NXP SmartMX / Infineon | ePassport, eID, contactless payment |
Contact CPU Cards
| Brand | Part Number (orderable) | On-chip Memory | Certification | Cross-Reference (Intl. ↔ China) | Application |
|---|---|---|---|---|---|
| NXP | SmartMX2 — P60C080 / P60C144 (contact) | 80 / 144 KB EEPROM · 384 KB ROM | CC EAL6+, EMVCo | ↔ Unigroup THD88 · Huada CIU98 | Banking, eID, TPM |
| NXP | SmartMX3 — P71D320 / P71D321 (contact configuration) | up to ~150 KB Flash | CC EAL6+, EMVCo | ↔ Unigroup THD89 · Huada CIU98 | Banking, SIM/UICC, eID |
| Infineon | SLE78CFX2400P / CFX4000P / CFX5000PH | 240 / 404 / 500 KB NVM | CC EAL6+ | ↔ Fudan FM1280 · Huada CIU98 | Banking, ePassport, eID, TPM |
| Infineon | SLE78CAX512SPHM (serial / contact) | 500 KB NVM | CC EAL6+ | ↔ Unigroup THD89 | Secure element, identity, authentication |
| STMicroelectronics | ST33 series (e.g. ST33J2M0 contact config) · ST23 legacy | up to 2 MB Flash | CC EAL6+, EMVCo | ↔ Fudan FM1280 · Huada CIU98 | Banking, eSIM, TPM (FIPS-140-3) |
| Samsung | S3FS / S3 secure-MCU series (contact config) | varies by part | CC EAL5+/6+, EMVCo | ↔ Unigroup THD89 | Banking, SIM, identity |
| Fudan / FMSH | FM1216 (16 KB) · FM1232 (32 KB) · FM1280 (≤64 KB) — contact config | 16 / 32 / up to 64 KB EEPROM · 64 KB ROM | Bank-grade · SM cert. · EAL4+ (FM1216/1232) | ↔ Infineon / NXP / ST | Social-security, banking, ESAM/PSAM, citizen card |
| Huada / HED | CIU5132A (contact SS) · SHC1302 (banking, 32-bit SC100) · CIU98M25 / CIU98M50 (SIM) | SHC1302: 256 KB ROM / 10 KB RAM · CIU98M50: 2.5 MB · CIU98M25: 1.25 MB Flash | CC EAL · payment cert. at product level | ↔ Infineon / NXP | Social-security, banking, super-SIM |
| Unigroup Tongxin | THD88-E48 / E80 / E120 / E160 · THC20 / THC80 (SIM) | ≈48 / 80 / 120 / 160 KB EEPROM | CC EAL5+/6+ · payment cert. at product level | ↔ Infineon / NXP | Banking, SIM/USIM, social-security, eID |
| Datang | DMT-CFN2HG6 | per ordering code | Bank-grade · payment cert. at product level | ↔ Infineon / NXP / ST | Banking, social-security, eHealth |
Dual-Interface CPU Cards
| Brand | Part Number (orderable) | On-chip Memory | Certification | Cross-Reference (Intl. ↔ China) | Application |
|---|---|---|---|---|---|
| NXP | SmartMX2 — P60D024 / P60D080 / P60D144 / P60D145 | 24 / 80 / 144 KB EEPROM · 384 KB ROM | CC EAL6+, EMVCo | ↔ Unigroup THD89 · Huada CIU9872B | Banking, ePassport, eID, transit |
| NXP | SmartMX3 — P71D320 / P71D321 | up to ~150 KB Flash · RSA 4096 / ECC 640 | CC EAL6+, EMVCo | ↔ Unigroup THD89 · Huada CIU9872B | Banking, ePassport, eID |
| Infineon | SLE78CLFX2400P / CLFX4000P (400VP) / CLFX5000PH / CLFX6280PH | 240 / 404 / 528 / 628 KB NVM | CC EAL6+, EMVCo | ↔ Unigroup THD89 · Huada CIU9872B | Banking, eID, ePassport, transit |
| STMicroelectronics | ST31G256 / G320 / G384 / G480 · ST31P320 / P450 | 256 / 320 / 384 / 480 KB · 320 / 450 KB Flash | CC EAL6+, EMVCo | ↔ Fudan FM1280 · Huada CIU9872B | Banking, transit, eID, biometric card |
| Samsung | S3 dual-interface secure-MCU series | varies by part | CC EAL5+/6+, EMVCo | ↔ Unigroup THD89 | Banking, identity, fingerprint card |
| Fudan / FMSH | FM1232 (32 KB) · FM12CD32 · FM1280 (≤64 KB) — Java / native COS | 32 / up to 64 KB EEPROM | Bank-grade · EAL4+ (FM1232) · payment cert. at product level | ↔ Infineon / NXP / ST | Banking, social-security, transit, health, citizen card |
| Huada / HED | CIU9872B / CIU9872B_01 (32-bit CPU) | 80 KB user memory | CC EAL6+, EMVCo (ICCN0219) | ↔ NXP SmartMX / Infineon / ST | Banking, digital-RMB wallet, ePassport |
| Unigroup Tongxin | THD89 (THD89 1.0.1 series, EMV one-chip dual-app) | large-capacity (per ordering code) | CC EAL6+ (SOGIS), EMVCo, SM L2, AEC-Q100 | ↔ NXP SmartMX / Infineon / ST | Banking (domestic+intl), eID, eUICC, social-security |
| Datang | DMT-CBS-CE3D | up to 128 KB EEPROM | Bank-grade · payment cert. at product level | ↔ Infineon / NXP / ST | Banking, eHealth, social-security |
| Nationz | Z32 secure-MCU series | per ordering code | CC EAL · SM L2 · payment cert. at product level | ↔ NXP / Infineon | Banking, identity, IoT secure element |
Cross-Reference — International ↔ China CPU Card Chips
| Interface | Intl. Part (Brand) | Intl. Origin | China Equivalent (Brand · Part) | Match Type | Security Level |
|---|---|---|---|---|---|
| Contactless | MIFARE DESFire EV3 MF3D8301 (NXP) | EU | Fudan FM1208-09 / FM1280 (RF) | Functional equiv. | CC EAL5+ |
| Contactless | SmartMX3 P71D321 (NXP) | EU | Unigroup THD89 / Huada CIU9872B | Functional equiv. | CC EAL6+ |
| Contact | SmartMX2 P60C080 / P60C144 (NXP) | EU | Unigroup THD88-E80 / Fudan FM1280 | Functional equiv. | CC EAL6+ |
| Contact | SLE78CFX4000P (Infineon) | EU | Fudan FM1280 / Huada SHC1302 | Functional equiv. | CC EAL6+ |
| Contact | ST33J2M0 (ST) | EU | Fudan FM1280 / Unigroup THD88 | Functional equiv. | CC EAL6+ |
| Dual | SmartMX2 P60D080 / SmartMX3 P71D320 (NXP) | EU | Unigroup THD89 / Huada CIU9872B | Functional equiv. | CC EAL6+ |
| Dual | SLE78CLFX5000PH (Infineon) | EU | Unigroup THD89 / Huada CIU9872B | Functional equiv. | CC EAL6+ |
| Dual | ST31G480 / ST31P320 (ST) | EU | Fudan FM1232 / Huada CIU9872B | Functional equiv. | CC EAL5+/6+ |
- Functional equivalent = same use-case & security level; card OS, applets and payment/ID certification are handled by the issuer per project (standard for any CPU-card change).
- Security Level = Common Criteria EAL at chip/platform level. THD89 (Unigroup) holds SOGIS CC EAL6+; CIU9872B (Huada) holds EMVCo cert. ICCN0219; most EU platforms are CC EAL6+ with EMVCo.
- CPU cards are not pin-for-pin drop-ins — migration is at the OS/personalization layer, not the hardware layer.
Standards & Compatibility — Dual-Interface CPU Card
Fully compliant with ISO/IEC 7816-1/2/3/4 and ISO/IEC 14443-1/2/3/4. Our dual-interface CPU cards are widely used in EMV contact and contactless payment, government ID, transit ticketing, physical access control and enterprise identification solutions.
Customization & Personalization
| Customization Item | Available Options |
|---|---|
| Card Body | PVC, PET, PETG, ABS; CR80 standard; custom thickness or finish on request |
| Printing | CMYK full-color printing, spot color, matte / glossy finish, anti-scratch overlay options |
| Security / Visual Features | Laser engraving, embossing, signature panel, hologram, UV printing or anti-counterfeit printing by project |
| Data Marking | UID, serial number, barcode, QR code, employee ID, membership number and project-specific data |
| Encoding / Personalization | Chip encoding, key initialization, applet loading, file structure and data preparation for both interfaces according to project requirements |
| Packaging | Bulk packaging, sorted serial batches, customized label or project packaging available |
FAQ — Dual-Interface CPU Card Procurement & Compatibility
What is a dual-interface CPU card and how is it different from a single-interface card?
A dual-interface CPU card uses one secure chip that supports both an ISO/IEC 7816 contact interface and an ISO/IEC 14443 contactless interface. A single-interface card only has one of these. Dual-interface cards allow the same card to work with both contact readers (such as ATMs or POS insert terminals) and contactless readers (such as tap-to-pay or transit gates).
Can the same application run over both the contact and contactless interface?
Yes. Because both interfaces access the same chip, memory and application logic, an applet loaded on the card can generally be used through either interface, subject to the chip platform, COS and applet design confirmed for your project.
Which chip platforms support dual-interface configuration?
Typical dual-interface chip options include NXP SmartMX2 / SmartMX3 (P60D / P71D series), Infineon SLE78CLFX series, ST31 dual-interface variants, Fudan FM1280, Huada CIU9872B and Unigroup THD89. The final chip should be confirmed according to memory size, algorithms, COS and certification requirements.
Do dual-interface cards need separate certification for EMV payment and government ID use?
Chip-level certifications (such as Common Criteria EAL) apply to the underlying platform. Finished card-level payment certification (EMVCo, card scheme) or government ID approval is project-dependent and obtained separately according to the issuer, applet and scheme requirements.
Can you personalize and print dual-interface cards before shipment?
Yes. Available personalization options include offset or digital printing, UID or serial number, barcode, QR code, laser engraving, embossing, signature panel, chip encoding and applet loading for both interfaces.
What information do you need for a project quotation?
Please share quantity, target application, required chip or memory, reader protocol for both interfaces, printing artwork, encoding requirements, card material, packaging and delivery schedule. If you are not sure about the chip, we can help narrow down the options.
Related Products — Secure Smart Card Solutions
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View DetailsContactless CPU Card
ISO 14443 contactless-only smart card for transit, access and eID projects.
View DetailsHigh-Security Smart Card
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Desktop or embedded readers supporting both contact and contactless CPU cards.
View DetailsBuild Your Dual-Interface CPU Card Project with CedaGlo
Tell us your application, reader infrastructure (contact, contactless or both), chip preference, memory, certification target and printing requirements. Our team will help confirm the right dual-interface CPU card configuration and provide a project-based quotation.